TSMC unveils 1.6nm process technology with backside power delivery

The linked article is about TSMC (Taiwan Semiconductor Manufacturing Company) unveiling its new 16nm process technology with backside power delivery, which aims to rival Intel's competing design. The article discusses TSMC's advancements in semiconductor manufacturing, including improved power efficiency and performance through the use of a backside power delivery system. It highlights how TSMC's new technology can potentially offer advantages over Intel's existing solutions, showcasing the ongoing competition and innovation in the semiconductor industry.