3D Heterogeneous Integration Powers New DARPA Fab
rbanffy Monday, November 10, 2025
Summary
The article discusses the advances in 3D heterogeneous integration, a technology that allows integrating different materials and functionalities on a single chip. It highlights the benefits of this approach, such as improved performance, reduced power consumption, and increased functionality, and examines the challenges and future developments in this field.
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Summary
spectrum.ieee.org